What is electroforming?
Similar to plating, electroforming is a process of electrochemically reducing metal ions to the surface of a substrate. The only difference is the thickness of the deposited layer. Typically, the plating thickness is less than 20 microns. Electroforming, on the other hand, requires the plating of a thicker layer, generally greater than 100 microns, and possibly up to 300 microns or more, that is to say from 0.1 to 0.3 mm. The primary interest of electroforming lies in the fact that this layer is sufficient on its own once separated from its substrate