What is electroforming?

Similar to plating, electroforming is a process of electrochemically reducing metal ions to the surface of a substrate. The only difference is the thickness of the deposited layer. Typically, the plating thickness is less than 20 microns. Electroforming, on the other hand, requires the plating of a thicker layer, generally greater than 100 microns, and possibly up to 300 microns or more, that is to say from 0.1 to 0.3 mm. The primary interest of electroforming lies in the fact that this layer is sufficient on its own once separated from its substrate


  • Creation of complex shapes and hollow parts with great precision
  • A deposit of a dozen μm is enough to dissolve the plastic molding parts
  • Accurate reproduction of the desired shape
  • Possibility of depositing on a rough surface


  • No limitation in the thickness of the deposit
  • Separation of the mold from the object
  • Personalized after-sales service


  • Longer deposition time compared to plating

The stages of electroforming and associated techniques