The electric power applied provokes a redox reaction of the metal ions between the cathode and the anode.
Plating is a process that generally limits the thickness of the deposit up to 20 microns. It is used for decorative purposes on an object.
On the other hand, electroforming, gives a thick deposit often higher than 100 microns and could go up to 300 microns and more.
Nearly no limitation on the deposit thickness.
The deposit can be separated from the substrate.
A personalised after-sales support.
Precision: Deposit time is longer compared to plating.
Creation of complex forms and hollow parts with great precision.
Precise reproduction of the desired shape.
Possibility to do 14K, 18K, 21K et 24K Gold electroforming but also Silver. Electroforming of platinum is currently being developped.